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OFDMA changed that. By composing subcarriers into resource units (RU), OFDMA channels can dynamically divide the instantaneous bandwidth to different users. OFDMA has suddenly increased the number of users that are instantly supported. The 20MHz bandwidth in the following figure is an example. Through subcarrier allocation, 20MHz can support up to 9 devices to access at the same time, 40MHz can support 18 devices, and so on. Fig. 2 uses the number of resource units available under OFDMA’s 20MHz% 0AWi-Fi 6 in which each subcarrier is 78.125khz. 20MHz is 256 subcarriers. 6 Edge indicates that there are 6 subcarriers as protection bands from the edge. ) It can be said that OFDMA has brought about a qualitative change in the capacity of Wi-Fi channels.

From the perspective of automakers, semiconductors will not be enough until 2024,” read next to the big news in the April 30 edition of the Nikkei News. In this article, Intel CEO Pat Gelsinger said at its financial results conference on April 28 that “due to capacity and production equipment constraints, semiconductor shortages will last until at least 2024. How long will this shortage of semiconductors last? I began to think that, as Intel’s chief executive said, “at least until 2024”, the semiconductor shortage will not disappear, and the semiconductor shortage will last for a long time. In this article, I would like to discuss the basic principles. If we come to a conclusion first, we speculate that there will be a long-term shortage of traditional analog and power semiconductors in the future due to the following reasons.

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

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